罗乐, 王. 袁. (2011). Preparation of Sn-Ag-In ternary solder bumps by electroplating in sequence and reliability. Journal of semiconductors, 32(8), 27-32. https://doi.org/10.1088/1674-4926/32/8/083005
Chicago Style (17th ed.) Citation罗乐, 王栋良 袁媛. "Preparation of Sn-Ag-In Ternary Solder Bumps by Electroplating in Sequence and Reliability." Journal of Semiconductors 32, no. 8 (2011): 27-32. https://doi.org/10.1088/1674-4926/32/8/083005.
MLA (9th ed.) Citation罗乐, 王栋良 袁媛. "Preparation of Sn-Ag-In Ternary Solder Bumps by Electroplating in Sequence and Reliability." Journal of Semiconductors, vol. 32, no. 8, 2011, pp. 27-32, https://doi.org/10.1088/1674-4926/32/8/083005.
Warning: These citations may not always be 100% accurate.