Enhanced mechanical properties and thermal conductivity of paraffin microcapsules shelled by hydrophobic-silicon carbide modified melamine-formaldehyde resin
[Display omitted] •A new microencapsulated phase change material was prepared by in-situ polymerization.•Hydrophobic-silicon carbide modified MF resin was used as shell material.•The encapsulation efficiency of modified microcapsules was higher.•The modified microcapsules have high thermal conductiv...
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Published in | Colloids and surfaces. A, Physicochemical and engineering aspects Vol. 603; p. 125219 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
20.10.2020
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Subjects | |
Online Access | Get full text |
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Summary: | [Display omitted]
•A new microencapsulated phase change material was prepared by in-situ polymerization.•Hydrophobic-silicon carbide modified MF resin was used as shell material.•The encapsulation efficiency of modified microcapsules was higher.•The modified microcapsules have high thermal conductivity and mechanical strength.
A new microencapsulated phase change material was prepared by in-situ polymerization using paraffin as core and hydrophobic-silicon carbide (H-SiC) modified melamine-formaldehyde (MF) resin as shell material. The effects of H-SiC dosage on the mechanical properties and thermal conductivity of H-SiC modified MF microcapsules were investigated. The prepared modified microcapsules have been characterized by FTIR, SEM, EDS, DSC, TGA and thermal conductivity meter (TCM). The results showed that the performance of modified microcapsules with 2% H-SiC was better than that of unmodified microcapsules: the microcapsules ruptured less under pressure and the melting permeability decreased by 10 % after pressing, the thermal conductivity increased by 55.82 % and the melting enthalpy reached 93.21 J g−1. Meanwhile, it also showed excellent thermal stability by TGA. The FTIR spectra and EDS analysis demonstrated that H-SiC particles were successfully incorporated into modified microcapsules and evenly distributed on the surface of microcapsules. |
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ISSN: | 0927-7757 1873-4359 |
DOI: | 10.1016/j.colsurfa.2020.125219 |