An approach of numerical multi-objective optimization in stacked packaging

• Published in: Microelectronics and reliability Vol. 48; no. 6; pp. 851 - 857
• Main Authors: Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.06.2008
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2008.04.010

The main aim for the development of small electronic packages is supported by an ongoing development of portable communication devices. Thin silicon dies are believed to improve the device performance as well as its reliability. Additionally, novel packaging techniques such as stacked packaging reduce packaging cost and size, and improve the functionality and reliability. In the case of the stacked packages, wafers are stacked to form a 3D multi-chip package. On the other hand, the electronic market requires novel and efficient numerical designing tools to deal properly with the optimization. The goal of the current work was to design a reliable numerical model of the stacked package and afterwards perform numerical multi-objective optimization in reference to a number of variables, which influence the stacked package reliability.