An analytical delay model for RLC interconnects

• Published in: IEEE transactions on computer-aided design of integrated circuits and systems Vol. 16; no. 12; pp. 1507 - 1514
• Main Authors: Kahng, A.B., Muddu, S.
• Format: Journal Article
• Language: English
• Published: IEEE 01.12.1997
• Subjects: Analytical models; Computational modeling; Delay effects; Delay estimation; Inductance; Routing; Signal synthesis; SPICE; Topology; Very large scale integration
• ISSN: 0278-0070; 1937-4151
• DOI: 10.1109/43.664231

Elmore delay has been widely used to estimate interconnect delays in the performance-driven synthesis and layout of very-large-scale-integration (VLSI) routing topologies. For typical RLC interconnections, however, Elmore delay can deviate significantly from SPICE-computed delay, since it is independent of inductance of the interconnect and rise time of the input signal. Here, we develop an analytical delay model based on first and second moments to incorporate inductance effects into the delay estimate for interconnection lines under step input. Delay estimates using our analytical model are within 15% of SPICE-computed delay across a wide range of interconnect parameter values. We also extend our delay model for estimation of source-sink delays in arbitrary interconnect trees. We observe significant improvement in the accuracy of delay estimates for interconnect trees when compared to the Elmore model, yet our estimates are as easy to compute as Elmore delay. Evaluation of our analytical models is several orders of magnitude faster than simulation using SPICE. We also illustrate the application of our model in controlling response undershoot/overshoot and reducing interconnect delay through constraints on the moments.