Bending reliability of Ni–MWCNT composite solder with a differential structure

• Published in: Microelectronics and reliability Vol. 113; p. 113934
• Main Authors: Lee, Choong-Jae, Hwang, Byeong-Uk, Min, Kyung Deuk, Kim, Jae-Ha, Jung, Seung-Boo
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.10.2020
• Subjects: Bending test; CNT; Composite; Solder joint; Solder joint; CNT; Composite; Bending test
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2020.113934

A carbon nanotube (CNT) has remarkable properties, but it has disadvantages in application because of its dispersal- and bonding-related issues. Metal–CNT composite materials are necessary in solving these problems. In this study, nickel (Ni)–multi-walled CNTs (Ni–MWCNTs) are synthesized through sequential processing, functionalizing, and electroless plating processes to deposit Ni nanoparticles on MWCNTs. The synthesized Ni–MWCNTs are used to fabricate composite solders with various contents (0, 0.05, 0.1, and 0.2 wt%). The test kit used for the 3-point bending test in this study is designed with a differential package structure to evaluate the bending reliabilities of the Ni–MWCNT composite materials with various contents. The crack initiation and propagation in the microstructure evolution solder joints are also investigated. The bending reliabilities improve with the BGA structure and indicate that the highest bending cycle fails with 0.1 wt% of Ni–MWCNTs. The chemical composition and distribution of the Ni–MWCNTs in the solder joints are investigated with electron probe microanalysis. •Test-kits for 3-point bending test were designed with differential structure.•Bending test was performed to evaluate the mechanical properties of solder joints.•Ni-MWCNTs composite solder could improve the bending reliability of Sn58Bi solder.