Influence of plasma ionization on the elastic modulus and tribology behavior of carbon films deposited by the HiPIMS technique

• Published in: Ceramics international Vol. 49; no. 2; pp. 2427 - 2439
• Main Authors: Rivera-Tello, César D., Flores-Ruiz, Francisco J., Flores-Jiménez, M., Flores, M.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 15.01.2023
• Subjects: Bonding structure; Carbon-ion-energies; Elastic modulus; Ion-energy-distribution-function; Tribology; Elastic modulus; Carbon-ion-energies; Ion-energy-distribution-function; Bonding structure; Tribology
• ISSN: 0272-8842; 1873-3956
• DOI: 10.1016/j.ceramint.2022.09.216

This work reveals the influence of discharge current on carbon-ion energies of plasma, elastic modulus, and friction coefficient at the nano- and macroscale of carbon films deposited via high-power impulse magnetron sputtering. Three applied discharge current conditions in deposition processes were employed to obtain three-carbon films of interest. The number of carbon ions with their energies was obtained via mimic tests of the deposition process using three similar discharge currents through a quadrupole mass spectrometer detector based on the time-averaged ion energy distribution function. The bonding structure of the films was evaluated using Raman spectroscopy, fitting the Diamond and Graphite peaks to obtain a semiquantitative analysis. The elastic modulus of the carbon films was determined from atomic force acoustic microscopy measurements avoiding the influence of the substrates. The friction coefficient was analyzed at the nanoscale via atomic force microscopy and at the macroscale via tribometry. Significant alterations were observed in the number and energy level of the carbon ions with the variation of discharge current. These alterations significantly influenced the bonding properties, elastic modulus, and tribology behavior. A higher elastic modulus and higher sp3 bond content were observed for the film with a lower number of carbon ions and less energy.