Delafossite CuAlO2 films prepared by reactive sputtering using Cu and Al targets

Composition and structure of CuAlO2 films, deposited through the dc-reactive sputtering method using Cu and Al elemental targets and Ar-diluted oxygen gas, were controlled by the Cu and Al deposition periods and the postannealing temperature. The delafossite CuAlO2 films were successfully prepared b...

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Published inThe Journal of physics and chemistry of solids Vol. 64; no. 9-10; pp. 1671 - 1674
Main Authors TSUBOI, N, TAKAHASHI, Y, KOBAYASHI, S, SHIMIZU, H, KATO, K, KANEKO, F
Format Conference Proceeding Journal Article
LanguageEnglish
Published Oxford Elsevier 01.09.2003
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Summary:Composition and structure of CuAlO2 films, deposited through the dc-reactive sputtering method using Cu and Al elemental targets and Ar-diluted oxygen gas, were controlled by the Cu and Al deposition periods and the postannealing temperature. The delafossite CuAlO2 films were successfully prepared by the postannealing of the films with [Cu]/[Al]=1 at temperatures higher than 700 C in the nitrogen atmosphere. In comparison with the optical absorption edge of the CuAlO2 films, those of Cu-rich and Al-rich films sifted to the longer and shorter wavelength regions, respectively. The shifts of the optical absorption edge in the off-stoichiometric films are interpretable to be due to the additional copper oxide or aluminum oxide phase. The resistivity of the high-temperature postannealed films with p-type was in the range of 10-102 OHM cm. 7 refs.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0022-3697
1879-2553
DOI:10.1016/S0022-3697(03)00194-X