On‐chip temperature compensation for optical transmitter modules
On‐chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)‐substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabri...
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Published in | Electronics letters Vol. 49; no. 3; pp. 202 - 204 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Stevenage
The Institution of Engineering and Technology
31.01.2013
Institution of Engineering and Technology |
Subjects | |
Online Access | Get full text |
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Summary: | On‐chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)‐substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 µm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10− 12 is achieved at a received input power of − 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20–100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block. |
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ISSN: | 1350-911X 0013-5194 1350-911X |
DOI: | 10.1049/el.2012.3350 |