On‐chip temperature compensation for optical transmitter modules

• Published in: Electronics letters Vol. 49; no. 3; pp. 202 - 204
• Main Authors: Sangirov, J., Park, T.‐W., Ukaegbu, I.A., Lee, T.‐W., Park, H.‐H.
• Format: Journal Article
• Language: English
• Published: Stevenage The Institution of Engineering and Technology 31.01.2013; Institution of Engineering and Technology
• Subjects: Applied sciences; BER; Circuit properties; compensation; Electric, optical and optoelectronic circuits; Electronics; error statistics; Exact sciences and technology; Integrated optics. Optical fibers and wave guides; modules; on‐chip temperature compensation; Optical and optoelectronic circuits; optical transmitter modules; optical transmitters; photodiode; photodiodes; size; size 0.13 mum; surface emitting lasers; Tx module; VCSEL; Vertical cavity laser; Output power; Thermal compensation; Bit error rate; Information rate; Silicon; Photodiode; Optical transmitters; Monitoring
• ISSN: 1350-911X; 0013-5194; 1350-911X
• DOI: 10.1049/el.2012.3350

On‐chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)‐substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 µm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10− 12 is achieved at a received input power of − 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20–100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block.