Hot Embossing for Whole Teflon Superhydrophobic Surfaces

• Published in: Coatings (Basel) Vol. 8; no. 7; p. 227
• Main Authors: Li, Jie, Yu, Wentao, Zheng, Deyin, Zhao, Xin, Choi, Chang-Hwan, Sun, Guangyi
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01.07.2018
• Subjects: Aluminum oxide; Channel flow; Contact angle; Embossing; Fluorinated ethylene propylenes; High aspect ratio; Hydrophobic surfaces; Hydrophobicity; Melt temperature; Melting points; Membranes; Molding (process); Molds; Nanowires; Plasma etching; Polymers; Polytetrafluoroethylene; Silicon substrates; Silicon wafers; United States > US
• ISSN: 2079-6412; 2079-6412
• DOI: 10.3390/coatings8070227

In this paper, we report a simple fabrication process of whole Teflon superhydrophobic surfaces, featuring high-aspect-ratio (>20) nanowire structures, using a hot embossing process. An anodic aluminum oxide (AAO) membrane is used as the embossing mold for the fabrication of high-aspect-ratio nanowires directly on a Teflon substrate. First, high-aspect-ratio nanowire structures of Teflon are formed by pressing a fluorinated ethylene propylene (FEP) sheet onto a heated AAO membrane at 340 °C, which is above the melting point of FEP. Experimental results show that the heating time and aspect ratios of nanopores in the AAO mold are critical to the fidelity of the hot embossed nanowire structures. It has also been found that during the de-molding step, a large adhesive force between the AAO mold and the molded FEP greatly prolongs the length of nanowires. Contact angle measurements indicate that Teflon nanowires make the surface superhydrophobic. The reliability and robustness of superhydrophobicity is verified by a long-term (~6.5 h) underwater turbulent channel flow test. After the first step of hot-embossing the Teflon nanowires, microstructures are further superimposed by repeating the hot embossing process, but this time with microstructured silicon substrates as micromolds and at a temperature lower than the melting temperature of the FEP. The results indicate that the hot embossing process is also an effective way to fabricate hierarchical micro/nanostructures of whole Teflon, which can be useful for applications of Teflon material, such as superhydrophobic surfaces.