Wafer sojourn time fluctuation analysis for time-constrained dual-arm multi-cluster tools with activity time variation

In semiconductor manufacturing systems, a time-constrained multi-cluster tool should be scheduled such that a wafer stays in a process chamber in a given time range to satisfy a wafer residency time constraint. In practice, activity time is subject to variation. It could lead to some fluctuation of...

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Published inInternational journal of computer integrated manufacturing Vol. 34; no. 7-8; pp. 734 - 751
Main Authors Yang, Fajun, Wu, Naiqi, Qiao, Yan, Su, Rong, Zhang, Chunjiang
Format Journal Article
LanguageEnglish
Published Taylor & Francis 03.08.2021
Subjects
multi-cluster tools
real-time scheduling
Semiconductor manufacturing systems
wafer residency time constraint
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Abstract In semiconductor manufacturing systems, a time-constrained multi-cluster tool should be scheduled such that a wafer stays in a process chamber in a given time range to satisfy a wafer residency time constraint. In practice, activity time is subject to variation. It could lead to some fluctuation of wafer residency time in a process chamber. Hence, it is crucial to analyze how wafer residency time varies with activity time variation. This issue is especially challenging for multi-cluster tools. This work focuses on determining the exact upper bound of wafer sojourn time delay resulted from activity time variation for dual-arm multi-cluster tools. After discussing their dynamic behaviours, it presents a two-level real-time operational architecture and a real-time control policy. Based on them, this work derives for the first time an efficient algorithm to calculate the exact upper bound of wafer sojourn time delay in a process chamber. As a result, engineers can test whether a given schedule is feasible. Several examples of industrial significance are used to demonstrate the application of the proposed approach.
AbstractList In semiconductor manufacturing systems, a time-constrained multi-cluster tool should be scheduled such that a wafer stays in a process chamber in a given time range to satisfy a wafer residency time constraint. In practice, activity time is subject to variation. It could lead to some fluctuation of wafer residency time in a process chamber. Hence, it is crucial to analyze how wafer residency time varies with activity time variation. This issue is especially challenging for multi-cluster tools. This work focuses on determining the exact upper bound of wafer sojourn time delay resulted from activity time variation for dual-arm multi-cluster tools. After discussing their dynamic behaviours, it presents a two-level real-time operational architecture and a real-time control policy. Based on them, this work derives for the first time an efficient algorithm to calculate the exact upper bound of wafer sojourn time delay in a process chamber. As a result, engineers can test whether a given schedule is feasible. Several examples of industrial significance are used to demonstrate the application of the proposed approach.
Author Qiao, Yan
Su, Rong
Wu, Naiqi
Zhang, Chunjiang
Yang, Fajun
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  organization: Huazhong University of Science and Technology
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Cites_doi 10.1109/TASE.2010.2046893
10.1109/TSMC.2014.2368995
10.1109/TASE.2011.2160452
10.1109/ICMLA.2018.00143
10.1109/TSMC.2015.2501232
10.1109/TASE.2007.912716
10.1109/66.311340
10.1109/TSM.2012.2199338
10.1109/66.641483
10.1109/TSM.2003.815203
10.1109/TASE.2015.2443107
10.1109/TASE.2011.2178023
10.1109/TASE.2017.2690443
10.1109/MRA.2015.2415047
10.1109/TSMC.2014.2318679
10.1109/TASE.2008.2008633
10.1080/17517575.2014.948936
10.1109/TSMCA.2012.2187890
10.1109/ACCESS.2016.2549546
10.1109/TASE.2018.2868004
10.1109/TSM.2018.2811125
10.1109/TASE.2017.2764105
10.1007/BF01324886
10.1109/TASE.2017.2682271
10.1109/TASE.2017.2771751
10.1109/TASE.2007.906678
10.1016/j.ins.2017.07.009
10.1109/TSMC.2016.2531697
10.1109/TCST.2016.2598762
10.1109/TASE.2005.851236
10.1109/TASE.2012.2192476
10.1109/TSM.2009.2039243
10.1109/70.964658
10.1109/TSMC.2017.2721979
10.1109/TSMC.2016.2598303
10.1109/66.536110
10.1109/TSMC.2015.2507161
10.1109/TSMC.2014.2332138
10.1109/TSM.2016.2530810
10.1109/TSM.2008.2000425
10.1109/TASE.2010.2046891
10.1109/TSMC.2016.2600583
10.1109/COASE.2007.4341844
10.1109/TSMC.2015.2507140
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References cit0011
cit0033
cit0012
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Wang J. P. (cit0026) 2018
cit0019
cit0017
cit0039
cit0018
cit0015
cit0037
cit0016
cit0038
cit0013
cit0035
cit0014
cit0022
cit0044
cit0001
cit0023
cit0045
cit0020
cit0042
cit0021
cit0043
cit0040
Yang. F. J. (cit0041) 2019
Kim H. J. (cit0008) 2018
Yang F. J. (cit0036) 2018
cit0009
cit0006
cit0028
cit0007
cit0029
cit0004
cit0048
cit0005
cit0027
cit0002
cit0024
cit0046
cit0003
cit0025
cit0047
References_xml – ident: cit0004
  doi: 10.1109/TASE.2010.2046893
– ident: cit0016
  doi: 10.1109/TSMC.2014.2368995
– ident: cit0032
  doi: 10.1109/TASE.2011.2160452
– ident: cit0005
  doi: 10.1109/ICMLA.2018.00143
– ident: cit0001
  doi: 10.1109/TSMC.2015.2501232
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  doi: 10.1109/TASE.2007.912716
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  doi: 10.1109/66.311340
– year: 2018
  ident: cit0026
  publication-title: IEEE Transactions on Automation Science and Engineering
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  doi: 10.1109/TSM.2012.2199338
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  doi: 10.1109/66.641483
– ident: cit0010
  doi: 10.1109/TSM.2003.815203
– ident: cit0007
  doi: 10.1109/TASE.2015.2443107
– ident: cit0033
  doi: 10.1109/TASE.2011.2178023
– ident: cit0012
  doi: 10.1109/TASE.2017.2690443
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  doi: 10.1109/MRA.2015.2415047
– ident: cit0039
  doi: 10.1109/TSMC.2014.2318679
– ident: cit0030
  doi: 10.1109/TASE.2008.2008633
– ident: cit0034
  doi: 10.1080/17517575.2014.948936
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  doi: 10.1109/TSMCA.2012.2187890
– ident: cit0046
  doi: 10.1109/ACCESS.2016.2549546
– ident: cit0011
  doi: 10.1109/TASE.2018.2868004
– ident: cit0037
  doi: 10.1109/TSM.2018.2811125
– ident: cit0044
  doi: 10.1109/TASE.2017.2764105
– ident: cit0024
  doi: 10.1007/BF01324886
– ident: cit0043
  doi: 10.1109/TASE.2017.2682271
– ident: cit0015
  doi: 10.1109/TASE.2017.2771751
– ident: cit0042
  doi: 10.1109/TASE.2007.906678
– ident: cit0045
  doi: 10.1016/j.ins.2017.07.009
– ident: cit0040
  doi: 10.1109/TSMC.2016.2531697
– ident: cit0023
  doi: 10.1109/TCST.2016.2598762
– year: 2018
  ident: cit0008
  publication-title: IEEE Transactions on Automation Science and Engineering
– ident: cit0014
  doi: 10.1109/TASE.2005.851236
– ident: cit0022
  doi: 10.1109/TASE.2012.2192476
– ident: cit0031
  doi: 10.1109/TSM.2009.2039243
– year: 2019
  ident: cit0041
  publication-title: IEEE Transactions on Control Systems Technology
– ident: cit0048
  doi: 10.1109/70.964658
– ident: cit0020
  doi: 10.1109/TSMC.2017.2721979
– ident: cit0047
  doi: 10.1109/TSMC.2016.2598303
– ident: cit0017
  doi: 10.1109/66.536110
– ident: cit0006
  doi: 10.1109/TSMC.2015.2507161
– ident: cit0027
  doi: 10.1109/TSMC.2014.2332138
– ident: cit0013
  doi: 10.1109/TSM.2016.2530810
– ident: cit0028
  doi: 10.1109/TSM.2008.2000425
– year: 2018
  ident: cit0036
  publication-title: IEEE Transactions on Systems, Man and Cybernetics: Systems
– ident: cit0003
  doi: 10.1109/TASE.2010.2046891
– ident: cit0019
  doi: 10.1109/TSMC.2016.2600583
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  doi: 10.1109/COASE.2007.4341844
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Snippet In semiconductor manufacturing systems, a time-constrained multi-cluster tool should be scheduled such that a wafer stays in a process chamber in a given time...
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SubjectTerms multi-cluster tools
real-time scheduling
Semiconductor manufacturing systems
wafer residency time constraint
Title Wafer sojourn time fluctuation analysis for time-constrained dual-arm multi-cluster tools with activity time variation
URI https://www.tandfonline.com/doi/abs/10.1080/0951192X.2020.1718767
Volume 34
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