Reaction fabrication and wear performance of TiCx/(Cu–A1) bonded diamond composites

Cu–TiC -bonded diamond composites were prepared by in-situ reaction sintering of Cu, Ti AlC , and diamond powders. The effect of Ti AlC content on the phase composition, microstructure, and grinding properties was investigated. Ti AlC was decomposed to TiC and Al. Then, Al was dissolved into the cry...

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Bibliographic Details
Published inInternational journal of materials research Vol. 109; no. 4; pp. 350 - 355
Main Authors Liang, Baoyan, Han, Danhui, Zhang, Wangxi, Wang, Yanzhi
Format Journal Article
LanguageEnglish
Published De Gruyter 01.04.2018
Subjects
Diamond
Reaction synthesis
TiC
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Summary:Cu–TiC -bonded diamond composites were prepared by in-situ reaction sintering of Cu, Ti AlC , and diamond powders. The effect of Ti AlC content on the phase composition, microstructure, and grinding properties was investigated. Ti AlC was decomposed to TiC and Al. Then, Al was dissolved into the crystal lattice of Cu to form a Cu(Al) solution. A carbon-rich transition layer was formed at the interface between the diamond and the matrix. Excess Al inhibited the formation of Cu solid solution and reacted with Cu to form Cu Al . Diamond may be damaged to some extent by adding excess Ti AlC in the raw materials, which may deteriorate the grinding performance of the composites. The grinding ratio value of copper–diamond composite was only 132, whereas that of the composites containing higher Ti AlC content in the raw materials was approximately 350.
ISSN:1862-5282
2195-8556
DOI:10.3139/146.111602