High strength and high electrical conductivity CuMg alloy prepared by cryorolling
The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu−0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conduct...
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| Published in | Transactions of Nonferrous Metals Society of China Vol. 29; no. 3; pp. 595 - 600 |
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| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
01.03.2019
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| Subjects | |
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| Abstract | The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu−0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conductivity measurement. The results show that for the cryorolled sample, the grain size is decreased by 41% compared with the sample processed at room temperature. With increasing thickness reduction, the microhardness of the alloy continuously increases and the electrical conductivity decreases. For the sample with 90% thickness reduction rolled at cryogenic temperature, the tensile strength and the electrical conductivity are 726 MPa and 74.5% IACS, respectively. The improved tensile strength can be mainly attributed to the grain boundaries strengthening and dislocation strengthening. |
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| AbstractList | The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu−0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conductivity measurement. The results show that for the cryorolled sample, the grain size is decreased by 41% compared with the sample processed at room temperature. With increasing thickness reduction, the microhardness of the alloy continuously increases and the electrical conductivity decreases. For the sample with 90% thickness reduction rolled at cryogenic temperature, the tensile strength and the electrical conductivity are 726 MPa and 74.5% IACS, respectively. The improved tensile strength can be mainly attributed to the grain boundaries strengthening and dislocation strengthening. |
| Author | ZHENG, Yu-feng TONG, Yun-xiang ZHANG, Dian-tao LI, Si-yuan LI, Li |
| Author_xml | – sequence: 1 givenname: Yun-xiang surname: TONG fullname: TONG, Yun-xiang email: tongyx@hrbeu.edu.cn organization: Institute of Materials Processing and Intelligent Manufacturing, College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China – sequence: 2 givenname: Si-yuan surname: LI fullname: LI, Si-yuan organization: Institute of Materials Processing and Intelligent Manufacturing, College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China – sequence: 3 givenname: Dian-tao surname: ZHANG fullname: ZHANG, Dian-tao organization: Institute of Materials Processing and Intelligent Manufacturing, College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China – sequence: 4 givenname: Li surname: LI fullname: LI, Li organization: Institute of Materials Processing and Intelligent Manufacturing, College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China – sequence: 5 givenname: Yu-feng surname: ZHENG fullname: ZHENG, Yu-feng organization: Department of Materials Science and Engineering, College of Engineering, Peking University, Beijing 100871, China |
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| CitedBy_id | crossref_primary_10_1016_j_msea_2022_142600 crossref_primary_10_1016_j_jmrt_2023_08_012 crossref_primary_10_3390_ma17123020 crossref_primary_10_1016_j_vacuum_2021_110315 crossref_primary_10_1016_S1003_6326_20_65393_6 crossref_primary_10_1166_mex_2022_2126 crossref_primary_10_3390_jmmp6050102 crossref_primary_10_1016_S1003_6326_19_65163_0 crossref_primary_10_1016_j_jallcom_2023_170729 crossref_primary_10_1016_j_matpr_2022_03_245 crossref_primary_10_1016_j_jallcom_2024_173996 crossref_primary_10_1080_10402004_2023_2217436 crossref_primary_10_1007_s11665_023_08283_9 crossref_primary_10_1016_j_wear_2020_203497 crossref_primary_10_1016_j_wear_2022_204549 crossref_primary_10_1016_j_msea_2023_145990 crossref_primary_10_3390_en15062093 crossref_primary_10_1016_S1003_6326_24_66465_4 crossref_primary_10_1038_s41598_024_57083_1 crossref_primary_10_3390_ma13214805 |
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| Snippet | The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu−0.2wt.%Mg alloy were investigated by... |
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| StartPage | 595 |
| SubjectTerms | cryorolling CuMg alloy grain size mechanical properties twin |
| Title | High strength and high electrical conductivity CuMg alloy prepared by cryorolling |
| URI | https://dx.doi.org/10.1016/S1003-6326(19)64968-X |
| Volume | 29 |
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