High strength and high electrical conductivity CuMg alloy prepared by cryorolling

The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu−0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conduct...

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Bibliographic Details
Published inTransactions of Nonferrous Metals Society of China Vol. 29; no. 3; pp. 595 - 600
Main Authors TONG, Yun-xiang, LI, Si-yuan, ZHANG, Dian-tao, LI, Li, ZHENG, Yu-feng
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.03.2019
Subjects
cryorolling
CuMg alloy
grain size
mechanical properties
twin
grain size
cryorolling
mechanical properties
twin
CuMg alloy
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Summary:The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu−0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conductivity measurement. The results show that for the cryorolled sample, the grain size is decreased by 41% compared with the sample processed at room temperature. With increasing thickness reduction, the microhardness of the alloy continuously increases and the electrical conductivity decreases. For the sample with 90% thickness reduction rolled at cryogenic temperature, the tensile strength and the electrical conductivity are 726 MPa and 74.5% IACS, respectively. The improved tensile strength can be mainly attributed to the grain boundaries strengthening and dislocation strengthening.
ISSN:1003-6326
DOI:10.1016/S1003-6326(19)64968-X