Polydopamine-assisted pixeled lead-free perovskite photosensors array

• Published in: Journal of alloys and compounds Vol. 936; p. 168067
• Main Authors: Dun, Guan-Hua, Li, Yuan-Yuan, Qin, Ken, Wu, Fan, Tan, Xi-Chao, Geng, Xiang-Shun, Wang, Chun-Lin, Zhang, Min-Shu, Wang, Zi, Wang, Yu-Han, Wang, He-Xuan, Xie, Dan, Yang, Yi, Tian, He, Ren, Tian-Ling
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 05.03.2023
• Subjects: Lead-free perovskite; Perovskite patterning; Pixeled perovskite photosensor; Polydopamine coating; Pixeled perovskite photosensor; Lead-free perovskite; Perovskite patterning; Polydopamine coating
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2022.168067

Perovskite is a promising photosensor material for direct integration on integrated circuit (IC) chips due to the low-temperature growth process. However, the pixeled perovskite integration technology for high-resolution imaging faces challenges because of the poor perovskite stability and complex substrates. This work demonstrates a pixeled perovskite integration method on complex substrates with polydopamine (PDA)-assisted hydrophilic-hydrophobic treatment. Compared with conventional hydrophilic-hydrophobic treatment, the rich functional group in PDA can endow patterned wetting-dewetting regions on complex substrates. Besides, the proper band alignment between PDA and perovskite film enables a 6.8-fold suppression of dark current and a detectivity improvement from 1.6 × 1010 to 5.8 × 1010 Jones. We demonstrate the pixeled Cs2AgBiBr6 perovskite photosensor array in SiO2-Au hybrid substrates and confirm the optical imaging function. These results can contribute to the direct integration of photosensors on IC chips in the future. •A hydrophilic-hydrophobic treatment method is proposed with polydopamine assistance.•Pixeled lead-free perovskite array is fabricated on SiO2-Au complex substrates.•The improved detectivity is obtained in the perovskite-polydopamine photosensor.