Al-Si controlled expansion alloys for electronic packaging applications

The demand for thermal management in electronic packaging (EP) and its allied industries, especially in high-power electronics, has grown in the last three decades due to the continuous miniaturization of electronic components. The thermal management of EP warrants metal/alloys/composite with unique...

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Bibliographic Details
Published inProgress in materials science Vol. 144; p. 101268
Main Authors Godbole, Kirtiratan, Bhushan, B., Narayana Murty, S.V.S., Mondal, K.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.08.2024
Subjects
Controlled expansion
Electronic packaging
Hypereutectic Al-Si alloys
Thermal conductivity
Thermal expansion
SPSed
PAS
XRD
EBSD
EDM
Cr
Cu
EDS
UTS
SLM
Electronic packaging
SPS
EDX
Thermal conductivity
CIPed
EC
MPa
FSP
CAD
EP
AM
Hipping
LSS
Controlled expansion
ROM
RD
OFHC
LVDT
SEM
NTE
PPC
RT
CNT
BHN
Al
SIMA
BUE
V
PLS
W
HIPed
Ni
EPMA
CE
Hypereutectic Al-Si alloys
TC
Thermal expansion
CT
CTE
PF
Si
FAST
Al-Si
IPF
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Summary:The demand for thermal management in electronic packaging (EP) and its allied industries, especially in high-power electronics, has grown in the last three decades due to the continuous miniaturization of electronic components. The thermal management of EP warrants metal/alloys/composite with uniquely low thermal expansion and high thermal conductivity. Controlled expansion (CE) materials play a significant role and impart tunable thermal properties. The first and second generations of CE alloys, like Invar, Kovar, and Elinvar, are unsuitable to provide high thermal conductivity for heat sinking along with low density, which are essential for EP materials. The third-generation hypereutectic Al-Si alloys overcome these limitations. The capability to tune the CTE values of the Al-Si CE alloys combined with their lower densities and high thermal conductivities has made them a preferred choice for electronic applications, such as carriers and heat sinks. However, poor machinability and the inability to prepare geometrically complex Al-Si CE alloy with conventional manufacturing processes pose challenges. A paradigm shift is taking place in fabricating components through additive manufacturing and friction stir processing, assisting in mitigating machining and shape complexity. The present work attempts to provide comprehensive details on the properties, microstructures, and processing techniques of hypereutectic Al-Si CE alloys and recent advancements.
ISSN:0079-6425
DOI:10.1016/j.pmatsci.2024.101268