A CMOS SPAD Sensor With a Multi-Event Folded Flash Time-to-Digital Converter for Ultra-Fast Optical Transient Capture
A digital silicon photomultiplier in 130-nm CMOS imaging technology implements time-correlated single photon counting at an order of magnitude beyond the conventional pile-up limit. The sensor comprises a 32 × 32 43% fill-factor single photon avalanche diode array with a multi-event folded-flash tim...
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Published in | IEEE sensors journal Vol. 18; no. 8; pp. 3163 - 3173 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
15.04.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A digital silicon photomultiplier in 130-nm CMOS imaging technology implements time-correlated single photon counting at an order of magnitude beyond the conventional pile-up limit. The sensor comprises a 32 × 32 43% fill-factor single photon avalanche diode array with a multi-event folded-flash time-to-digital converter architecture operating at 10 GS/s. 264 bins × 16 bit histograms are generated and read out from the chip at a maximal 188 kHz enabling fast time resolved scanning or ultrafast low-light event capture. Full optical and electrical characterization results are presented. |
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ISSN: | 1530-437X 1558-1748 |
DOI: | 10.1109/JSEN.2018.2803087 |