Analysis of a partially sealed package for microstrip-line circuits

A partially sealed package formed by two metal diaphragms with or without an absorber is proposed and analyzed for shielded microstrip-line circuits. The mode-matching method, method of lines, and finite-element method are mixed appropriately to investigate the package. For a specific analysis, an e...

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Bibliographic Details
Published inIEEE transactions on microwave theory and techniques Vol. 46; no. 12; pp. 2124 - 2130
Main Authors Chen, Hao-Hui, Chung, Shyh-Jong
Format Journal Article
LanguageEnglish
Published IEEE 01.12.1998
Subjects
Distributed parameter circuits
Electromagnetic interference
Electromagnetic scattering
Electromagnetic waveguides
Frequency
Microstrip components
Packaging
Power transmission lines
Resonance
Transmission line discontinuities
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Summary:A partially sealed package formed by two metal diaphragms with or without an absorber is proposed and analyzed for shielded microstrip-line circuits. The mode-matching method, method of lines, and finite-element method are mixed appropriately to investigate the package. For a specific analysis, an electric current filament and a microstrip-line gap are chosen to simulate, respectively, an active circuit element (CE) and a passive CE to be packaged. The suppression effect of the package on the spurious (higher order) modes and the influence on the dominant mode are fully studied by comparing the excitation and scattering characteristics of the CE's with and without the package.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9480
1557-9670
DOI:10.1109/22.739293