Thermal and stress analysis in Nd: YAG laser rod with different double end pumping methods
In this work, the finite element analysis has been used to predict the temperature distribution in Nd: YAG laser rod; double end-pumped by two methods Gaussian or top hat beam. The rod is cooled by water passing through annular, which surrounds the active media. The temperature distribution has been...
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Published in | Thermal science Vol. 15; no. suppl. 2; pp. 399 - 407 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Belgrade
Society of Thermal Engineers of Serbia
2011
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Subjects | |
Online Access | Get full text |
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Summary: | In this work, the finite element analysis has been used to predict the
temperature distribution in Nd: YAG laser rod; double end-pumped by two
methods Gaussian or top hat beam. The rod is cooled by water passing through
annular, which surrounds the active media. The temperature distribution has
been used to predict numerically, the nodal displacements, strain and stress
based on the principle of virtual work. The main task is to determine the
temperature distribution in Nd: YAG laser rod, the subsequent value and
location of maximum tensile hoop stress associated with the two types of the
double end pumping for different absorption power. Some conclusions are
obtained; as the radius pumping ratio increases the location of maximum hoop
stress will move toward the periphery and vice-versa. Small reduction is
observed in the location of maximum hoop stress when pumping method change
from the top-hat beam to Gaussian beam, especially at low radius pumping
ratio and high absorption power. Top hat beam end pumping will cause more
intense tension hoop stress at the facets of the rod than that of Gaussian
beam even the later may produce high center temperature. This work may be
important for designer while choosing the type of pumping, maximum produced
tensile hoop stress and its location, especially when hoop stress is
ultimate.
nema |
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ISSN: | 0354-9836 2334-7163 |
DOI: | 10.2298/TSCI101201004S |