TEM study of electrodeposited Ni/Cu multilayers in the form of nanowires

Ni/Cu multilayers were electrodeposited within nanopores of polycarbonate membranes. Morphology of the obtained nanowires, which are 60 ∼ 80 nm in diameter and ∼5 μm in length, has been studied by transmission electron microscopy. It has been observed that the thickness of Ni/Cu layers increases as...

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Bibliographic Details
Published inThin solid films Vol. 288; no. 1; pp. 86 - 89
Main Authors Wang, L., Yu-Zhang, K., Metrot, A., Bonhomme, P., Troyon, M.
Format Journal Article
LanguageEnglish
Published Elsevier B.V 15.11.1996
Subjects
Electrochemistry
Multilayers
Nanostructures
Transmission electron microscopy
Electrochemistry
Multilayers
Transmission electron microscopy
Nanostructures
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Summary:Ni/Cu multilayers were electrodeposited within nanopores of polycarbonate membranes. Morphology of the obtained nanowires, which are 60 ∼ 80 nm in diameter and ∼5 μm in length, has been studied by transmission electron microscopy. It has been observed that the thickness of Ni/Cu layers increases as the nanowire is growing; Ni layers and Cu layers grow epitaxially and the multilayers have a preferred growth direction 〈111〉 parallel to the wire axis.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(96)08791-3