Optimization of transient temperature uniformity in RTP systems

Independent, dynamic control of multiple lamps in a rapid thermal processing (RTP) system is a potential solution to the problem of transient wafer temperature nonuniformity. The author addresses the problem of minimizing temperature error during transients when independent control of lamp power set...

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Bibliographic Details
Published inIEEE transactions on electron devices Vol. 39; no. 1; pp. 205 - 207
Main Author Norman, S.A.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.01.1992
Institute of Electrical and Electronics Engineers
Subjects
Applied sciences
Doping
Electronics
Epitaxial growth
Exact sciences and technology
Impurities
Rapid thermal processing
Rough surfaces
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
Stress
Surface morphology
Surface roughness
Temperature
Control
Temperature
Simulation
Error
Optimization
Wafer
Transients
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Summary:Independent, dynamic control of multiple lamps in a rapid thermal processing (RTP) system is a potential solution to the problem of transient wafer temperature nonuniformity. The author addresses the problem of minimizing temperature error during transients when independent control of lamp power settings is available. He presents a technique based on linear programming for minimization of worst case error during temperature trajectory following, given a model of an axisymmetric, multilamp RTP system.< >
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9383
1557-9646
DOI:10.1109/16.108233