A systems perspective on digital interconnection technology

The work describes, from a switching system designers perspective, present digital interconnection technologies and needs. The discussion begins at the chip-to-chip interconnection level and proceeds to the frame-to-frame level. The authors evaluate the optimal packaging and interconnection technolo...

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Bibliographic Details
Published inJournal of lightwave technology Vol. 10; no. 6; pp. 811 - 827
Main Authors Nordin, R.A., Levi, A.F.J., Nottenburg, R.N., O'Gorman, J., Tanbun-Ek, T., Logan, R.A.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.06.1992
Institute of Electrical and Electronics Engineers
Subjects
Applied sciences
Bandwidth
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuit interconnections
Optical arrays
Optical devices
Optical interconnections
Optical transmitters
Packaging
Switching systems
Telecommunication computing
Telecommunication switching
Encapsulation
Interconnection
Technology
Electronic packaging
Telecommunication switching
Reliability
Digital transmission
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Summary:The work describes, from a switching system designers perspective, present digital interconnection technologies and needs. The discussion begins at the chip-to-chip interconnection level and proceeds to the frame-to-frame level. The authors evaluate the optimal packaging and interconnection technology that should be used in future system designs. The analysis suggests that parallel optical data links based on a laser array technology implemented at the board-to-board level are presently advantageous. This analysis, as well as a detailed description of laser gate arrays, is also included.< >
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0733-8724
1558-2213
DOI:10.1109/50.143082