Time-domain simulation of large lossy interconnect systems on conducting substrates

• Published in: IEEE transactions on circuits and systems. 1, Fundamental theory and applications Vol. 45; no. 9; pp. 909 - 918
• Main Authors: Braunisch, H., Grabinski, H.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.09.1998; Institute of Electrical and Electronics Engineers
• Subjects: Analytical models; Applied sciences; Approximation algorithms; Circuit simulation; Delay; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Frequency dependence; Integrated circuit interconnections; Integrated circuits; Modal analysis; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Time domain analysis; Transmission line matrix methods; Transmission lines; Transmission line; Time domain method; Wave propagation; Modal analysis; Circuit design; Interconnection; Least squares method; Integrated circuit; TEM mode; Chip; Implementation
• ISSN: 1057-7122; 1558-1268
• DOI: 10.1109/81.721257

The most general class of uniform transmission-line systems is considered, assuming that samples of the frequency dependent parameter matrices R, L, G, and C are given. In particular, substrate effects which influence wave propagation along integrated circuits (IC) interconnects typically over a very broad range of frequencies are included. A time-domain simulation technique which can handle this problem is described in detail. The algorithm can be embedded in general-purpose circuit simulators and is based on modal analysis, mode tracking, modal delay separation, broadband rational function least squares approximation directly in partial fraction form, and recursive convolution. A numerical example for realistic geometry and material parameters of the examined transmission line structure shows the significance of substrate effects in the frequency and-more important-in the time domain.