New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their perform...

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Published inJournal of lightwave technology Vol. 12; no. 11; pp. 1963 - 1970
Main Authors Hayashi, T., Katsura, K., Tsunetsugu, H.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.11.1994
Institute of Electrical and Electronics Engineers
Subjects
Applied sciences
Bonding
Circuit properties
Diodes
Driver circuits
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
High speed optical techniques
Integrated optics
Integrated optics. Optical fibers and wave guides
Optical and optoelectronic circuits
Optical devices
Optical modulation
Optical transmitters
SPICE
Wire
Integrated optics
Circuit design
Performance characteristic
Equivalent circuit
Injection laser
Optical modulation
Modeling
Optical interconnection
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Abstract This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their performances are compared to those of a monolithic LD-driver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular emphasis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patterns modulated at signal speeds up to 30 Gb/s by the new hybrid integrated LD-drivers were hardly inferior to those by the monolithic LD-driver, whereas those by conventional hybrid ones were greatly degraded over 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alternative to monolithic ones for high-speed optical transmitters.< >
AbstractList This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their performances are compared to those of a monolithic LD-driver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular emphasis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patterns modulated at signal speeds up to 30 Gb/s by the new hybrid integrated LD-drivers were hardly inferior to those by the monolithic LD-driver, whereas those by conventional hybrid ones were greatly degraded over 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alternative to monolithic ones for high-speed optical transmitters.< >
This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their performances are compared to those of a monolithic LD-driver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular emphasis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patterns modulated at signal speeds up to 30 Gb/s by the new hybrid integrated LD-drivers were hardly inferior to those by the monolithic LD-driver, whereas those by conventional hybrid ones were greatly degraded over 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alternative to monolithic ones for high-speed optical transmitters
Author Hayashi, T.
Katsura, K.
Tsunetsugu, H.
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Issue 11
Keywords Integrated optics
Circuit design
Performance characteristic
Equivalent circuit
Injection laser
Optical modulation
Modeling
Optical interconnection
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Snippet This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one,...
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StartPage 1963
SubjectTerms Applied sciences
Bonding
Circuit properties
Diodes
Driver circuits
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
High speed optical techniques
Integrated optics
Integrated optics. Optical fibers and wave guides
Optical and optoelectronic circuits
Optical devices
Optical modulation
Optical transmitters
SPICE
Wire
Title New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics
URI https://ieeexplore.ieee.org/document/336061
https://search.proquest.com/docview/28483508
Volume 12
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