New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

• Published in: Journal of lightwave technology Vol. 12; no. 11; pp. 1963 - 1970
• Main Authors: Hayashi, T., Katsura, K., Tsunetsugu, H.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.11.1994; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Bonding; Circuit properties; Diodes; Driver circuits; Electric, optical and optoelectronic circuits; Electronics; Exact sciences and technology; High speed optical techniques; Integrated optics; Integrated optics. Optical fibers and wave guides; Optical and optoelectronic circuits; Optical devices; Optical modulation; Optical transmitters; SPICE; Wire; Integrated optics; Circuit design; Performance characteristic; Equivalent circuit; Injection laser; Optical modulation; Modeling; Optical interconnection
• ISSN: 0733-8724; 1558-2213
• DOI: 10.1109/50.336061

This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their performances are compared to those of a monolithic LD-driver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular emphasis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patterns modulated at signal speeds up to 30 Gb/s by the new hybrid integrated LD-drivers were hardly inferior to those by the monolithic LD-driver, whereas those by conventional hybrid ones were greatly degraded over 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alternative to monolithic ones for high-speed optical transmitters.< >