Ion-plated titanium carbide coatings

• Published in: Thin solid films Vol. 22; no. 1; pp. 111 - 120
• Main Author: Stowell, William R.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.01.1974
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/0040-6090(74)90284-3

A new development in the field of coatings is the reactive ion-plating process. In this process, metal evaporated from a source reacts with an atmosphere of mixed gases. The reaction can take place in the gas phase before the material deposits, or it can take place on the substrate. The stoichiometry of the reaction can be controlled by adjusting at least one of several process parameters. This technique allows the formation of carbides, nitrides, oxides and other materials and provides a method of controlling the stoichiometry of the deposited material. The ability of the process to provide graded stoichiometry through a coating layer has made possible the application of adherent coatings to difficult-to-coat substrates. This prevents, for instance, a sharp boundary zone between materials which have greatly differing thermal coefficients of expansion. The dependence of the coating composition upon the deposition parameters of gas pressure, substrate voltage and evaporation rates from the source is discussed. The application of the technique in the coating of titanium and mild-steel substrates with titanium carbide is discussed. Photomicrographs and hardness data for the deposited films are presented.