Air cooling of front-end electronics for silicon detectors in a collider experiment

• Published in: Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Vol. 345; no. 2; pp. 284 - 288
• Main Authors: Lock, J.S., Bertson, E., Boissevain, J., Clark, D.J., Collier, W., Hammock, R., Jacak, B.V., Morgan, A., Roybal, P., Shaheen, S., Simon-Gillo, J., Sullivan, J.P.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 15.06.1994
• ISSN: 0168-9002; 1872-9576
• DOI: 10.1016/0168-9002(94)91003-0

We have investigated the feasibility of using room temperature air to cool front-end electronics for silicon microstrip and pad detectors in a collider experiment. Advantages of air cooling include minimal material in the path of the particles and no potential of coolant spills in the silicon region. A prototype cooling system was tested with heat provided by flat resistive heaters. Heat loads from 1 to 27 mW/channel were studied, making the results applicable to various silicon detector systems. The measurements are compared to cooling system performance predictions. A set of simple equations has been identified and tested which reliably describe the lab setup.