Integrated Pockels Modulators on Silicon Photonics Platform

Electro‐optic (EO) modulators are essential components in various fields, including optical communication, free‐space communication, microwave photonics, sensing, and light detection and ranging. The EO modulation enables the fast conversion of electric signals into optical signals, facilitating the...

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Published inAdvanced Physics Research Vol. 4; no. 4
Main Authors Shen, Jian, Zhang, Yong, Chen, Yuqi, Zhou, Wenfeng, Zhang, Xun, Sun, Min, Wang, Xin, Zhang, Lei, Li, Xingfeng, Li, Jingchi, Su, Yikai
Format Journal Article
LanguageEnglish
Published Edinburgh John Wiley & Sons, Inc 01.04.2025
Wiley-VCH
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Summary:Electro‐optic (EO) modulators are essential components in various fields, including optical communication, free‐space communication, microwave photonics, sensing, and light detection and ranging. The EO modulation enables the fast conversion of electric signals into optical signals, facilitating the precise manipulation of light. With advancements in fabrication processing techniques, next‐generation integrated EO modulators have demonstrated substantial improvements in modulation efficiency, bandwidth, and footprint. Here, the latest research progress in integrated EO modulation, focusing on the principle of the Pockels effect, key modulation metrics, novel EO thin‐film material platforms, and innovative device architectures is overviewed. Finally, it is evaluated different schemes and provide perspectives on future trends in developing integrated EO modulators, highlighting both the advantages and challenges of integrated EO modulation, including waveguide and electrode engineering, integrated methods, and other applications for large‐scale photonic integrated circuits. Integrated Pockels modulators have emerged as crucial building blocks in many applications for transforming electric signals into optical signals quickly and efficiently. In this review, various types of modulators based on different Pockels platforms are outlined. Meanwhile, modulation metrics, integration strategies, fabrication processes, and potential applications are discussed and explored.
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ISSN:2751-1200
2751-1200
DOI:10.1002/apxr.202400096