Effect of Hybrid MWCNTs/Graphene on Mechanical Properties of Reinforced Unidirectional E-Glass/Epoxy Composite

• Published in: Materials today : proceedings Vol. 18; pp. 1540 - 1547
• Main Authors: Turaka, S., Kumar Reddy, K.Vijaya
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 2019
• Subjects: Graphene; Mechanical properties; Multi-walled carbon nanotubes; Scanning electron microscopy; Mechanical properties; Scanning electron microscopy; Multi-walled carbon nanotubes; Graphene
• ISSN: 2214-7853; 2214-7853
• DOI: 10.1016/j.matpr.2019.06.624

Multi-walled Carbon nanotubes (MWCNTs) and Graphene (Gnps) are attracting scientific and industrial interest by virtue of their outstanding characteristics because of its excellent performance in mechanical, thermal and electrical applications. The present research problem deals with the fabrication and characterization of reinforced unidirectional E-glass fiber/epoxy composites enhanced by MWCNTs and Gnps. In the present study three process parameters were considered such as nanofillers ranging from 0.1-0.3 wt% of MWCNTs, 0.1-0.3 wt% of Gnps, and 0.1-0.3 wt% of MWCNTs/Gnps process to disperse hybrid nanoparticles in epoxy resin and in addition to by orienting unidirectional E-glass reinforced woven fabric in longitudinal (0°) and transverse (90°) direction. But, the study of the properties of the glass fiber reinforced epoxy composites with different fiber orientations has found to be limited. Fabrication of E-glass fiber composites was carried out by vacuum bagging layup technique, and the specimens were prepared with respect to the ASTM standards and mechanical properties testing was performed. The results shows that hybrid 0.2 wt% MWCNTs/Gnps/E-glass/epoxy resin composite gave better tensile properties as compared to other nanophased E-glass/epoxy resin composite. The scanned electronic microscopic study for the fractured samples reveals a significant increase in the fiber-matrix interface adhesion whereas decrease in fiber breakage, fiber pullout and debonding.