Analysis of stress concentration in isotropic and orthotropic plates with hole under uniformly distributed loading conditions

• Published in: Materials today : proceedings Vol. 4; no. 2; pp. 740 - 745
• Main Authors: Tadepalli, Gayathri, Gayatri Vineela, M., Janardhan Reddy, T.A.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 2017
• Subjects: Boundary conditions; Finite Element Method; Isotropic; Orthotropic(E-glass/Epoxy); Plate; SCF; Boundary conditions; Finite Element Method; Orthotropic(E-glass/Epoxy); Isotropic; SCF; Plate
• ISSN: 2214-7853; 2214-7853
• DOI: 10.1016/j.matpr.2017.01.080

The Behaviour of Stress Concentration Factor in rectangular and circular plates of Isotropic (Magnesium alloy) and Orthotropic material (E-glass/Epoxy) under static loading in transverse direction (UDL) has been studied. Aim of this work was to analyse the effect of D/A (From 0.1 to 0.9) and D/t ratio (From 0 to 90) upon Stress Concentration Factor (SCF) for Isotropic and Orthotropic material under given boundary conditions. To solve this problem, Finite Element Method (i.e. FEM Software) ‘ANSYS’ was used. Element length of 2mm was adopted. For design, a quarter rectangular plate and a complete circular plate were considered. Orthotropic material of rectangular plate for given boundary conditions achieved more Stress Concentration Factor than Isotropic Material. In Orthotropic Material, circular plate, Stress concentration was observed less than Rectangular Plate, whereas in Isotropic circular plate, SCF is almost similar to rectangular plate. Material properties of Orthotropic material has vital role for this behaviour when compared with Isotropic material and Geometry of the plate was also a reason to get SCF for Rectangular plate.