Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink
A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be remo...
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Published in | Optics and laser technology Vol. 88; pp. 128 - 133 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Kidlington
Elsevier BV
01.02.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be removed from the film by rinsing it with the dispersing agent used to synthesize the ink, disclosing a conductive Cu pattern. A minimum resistivity of 8.46x10-5 Ω cm was obtained for the Cu lines with 10-20 μm widths. The feasibility of this method for metallization was demonstrated by fabricating a complex Cu electric circuit on an indium tin oxide-coated glass substrate. The selective laser sintering approach provides a simple, cost-effective alternative to conventional lithography for the production of electrode or metallization patterns. |
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ISSN: | 0030-3992 1879-2545 |
DOI: | 10.1016/j.optlastec.2016.09.021 |