Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink

A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be remo...

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Bibliographic Details
Published inOptics and laser technology Vol. 88; pp. 128 - 133
Main Authors Min, Hyungsuk, Lee, Byoungyoon, Jeong, Sooncheol, Lee, Myeongkyu
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier BV 01.02.2017
Subjects
Copper
Cupric formate
Indium tin oxides
Laser sintering
Metallizing
Patterning
Studies
Synthesis
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Summary:A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be removed from the film by rinsing it with the dispersing agent used to synthesize the ink, disclosing a conductive Cu pattern. A minimum resistivity of 8.46x10-5 Ω cm was obtained for the Cu lines with 10-20 μm widths. The feasibility of this method for metallization was demonstrated by fabricating a complex Cu electric circuit on an indium tin oxide-coated glass substrate. The selective laser sintering approach provides a simple, cost-effective alternative to conventional lithography for the production of electrode or metallization patterns.
ISSN:0030-3992
1879-2545
DOI:10.1016/j.optlastec.2016.09.021