Effect of the underlayer on the microstructure and surface evolution in Al-0.5wt.%Cu polycrystalline thin films

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Bibliographic Details
Published inJournal of electronic materials Vol. 31; no. 1; pp. 55 - 65
Main Authors LITA, Adriana E, SANCHEZ, John E
Format Conference Proceeding Journal Article
LanguageEnglish
Published New York, NY Institute of Electrical and Electronics Engineers 2002
Springer Nature B.V
Subjects
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science; rheology
Deposition by sputtering
Exact sciences and technology
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings; film growth and epitaxy
Physics
Structure and morphology; thickness
Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
Grain size
Roughness
Polycrystals
Copper additions
Aluminium
Crystal growth from vapors
Experimental study
Texture
Substrates
Thin films
Magnetrons
Cathode sputtering
Morphology
Growth mechanism
Titanium
Microstructure
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ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-002-0173-9