Shielding effect of a diaphragm in a packaged microstrip circuit

• Published in: IEEE transactions on microwave theory and techniques Vol. 43; no. 5; pp. 1082 - 1086
• Main Authors: Chen, Hao-Hui, Chung, Shyh-Jong
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.05.1995; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Circuit properties; Distributed parameter circuits; Electric, optical and optoelectronic circuits; Electromagnetic scattering; Electromagnetic waveguides; Electronics; Exact sciences and technology; Microstrip; Microwave circuits; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits; Mode matching methods; Packaging; Power transmission lines; Transmission line discontinuities; Transmission line theory; Encapsulation; Theoretical study; Microstrip; Scattering factor; Waveguide; Mode power distribution; Mode matching method; Thickness; Shielding effect; Size effect; Method of lines; Microwave circuit; Numerical simulation; Diaphragm; Propagation mode
• ISSN: 0018-9480; 1557-9670
• DOI: 10.1109/22.382069

The scattering of a diaphragm in a packaged microstrip line is investigated using the mode-matching method together with the method of lines. Instead of analyzing the discontinuity in the microstrip, this paper tackles the variation of the waveguide housing. The influences of the thickness and the depth of the diaphragm on the scatterings of the dominant mode and higher-order modes are analyzed based on a comparison of the modal power distributions. Finally, the shielding effect of a pair of closely spaced diaphragms is investigated.< >