3-D Integration Technologies [Scanning the Issue]

This issue responds to the observation that only the surface of an integrated circuit is electrically active; it explores three-dimensional techniques to extend Moore's Law by a variety of approaches including the thinning and stacking of chips.

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Bibliographic Details
Published inProceedings of the IEEE Vol. 97; no. 1; pp. 5 - 8
Main Authors Campardo, Giovanni, Ripamonti, Giancarlo, Micheloni, Rino
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.01.2009
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Applied sciences
Chips
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuit technology
Integrated circuits
Law
Moore's law
Power system reliability
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Special issues and sections
Stacking
Surface chemistry
Thermal management
Thinning
Three dimensional
Three dimensional displays
Three dimensional structure
Integrated circuit
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More Information
Summary:This issue responds to the observation that only the surface of an integrated circuit is electrically active; it explores three-dimensional techniques to extend Moore's Law by a variety of approaches including the thinning and stacking of chips.
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ISSN:0018-9219
1558-2256
DOI:10.1109/JPROC.2008.2007450