Efficacy of boron nitride encapsulation against plasma-processing of 2D semiconductor layers

• Published in: Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vol. 39; no. 3
• Main Authors: Kumar, Pawan, Figueroa, Kelotchi S., Foucher, Alexandre C., Jo, Kiyoung, Acero, Natalia, Stach, Eric A., Jariwala, Deep
• Format: Journal Article
• Language: English
• Published: 01.05.2021
• ISSN: 0734-2101; 1520-8559
• DOI: 10.1116/6.0000874

Two-dimensional (2D) transition metal dichalcogenides (TMDCs) are the subject of intense investigation for applications in optics, electronics, catalysis, and energy storage. Their optical and electronic properties can be significantly enhanced when encapsulated in an environment that is free of charge disorder. Because hexagonal boron nitride (h-BN) is atomically thin, highly crystalline, and is a strong insulator, it is one of the most commonly used 2D materials to encapsulate and passivate TMDCs. In this report, we examine how ultrathin h-BN shields an underlying MoS2 TMDC layer from the energetic argon plasmas that are routinely used during semiconductor device fabrication and postprocessing. Aberration-corrected scanning transmission electron microscopy is used to analyze defect formation in both the h-BN and MoS2 layers, and these observations are correlated with Raman and photoluminescence spectroscopy. Our results highlight that h-BN is an effective barrier for short plasma exposures (<30 s) but is ineffective for longer exposures, which result in extensive knock-on damage and amorphization in the underlying MoS2.