Novel deep eutectic solvent made from sulfonic acid with acetamide, an ATR-IR characterization of different mole compositions and physicochemical properties of 1:6 mol ratios with electrodeposition of copper

Interest in DES is leveling up with increasing need for providing additional knowledge on their behavior and comparability with other type of solvents. In- addition cheap and environmental safe DES are emerging as attractive solvents in many applications. A novel deep eutectic solvent was made by si...

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Bibliographic Details
Published inMaterials today : proceedings Vol. 60; pp. 1234 - 1240
Main Authors Enaad, Ali Khalaf, Abood, Hadi M.A.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 2022
Subjects
Acetamide
ATR-IR
Copper
cyclovoltammogram
DES
Electrodeposion
Sulfonic acid
UV-visible
UV-visible
DES
IL
ATR-IR
Electrodeposion
Acetamide
cyclovoltammogram
Copper
Sulfonic acid
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Summary:Interest in DES is leveling up with increasing need for providing additional knowledge on their behavior and comparability with other type of solvents. In- addition cheap and environmental safe DES are emerging as attractive solvents in many applications. A novel deep eutectic solvent was made by simple mixing different mole ratios of sulfonic acid with acetamide. The effect of mole ratio on the interaction between the DES components was observed by ATR-IR with gradual color changes of formed DES. At 1 to 2 mol ratio respectively a different vibrational interactions is recorded. The least viscose DES of sulfonic acid with acetamide (1:6) shows temperature dependents of conductivity, viscosity and density with similar behaviors of other DESs. The cyclovolatammograms of 1:6 mol ratio of DES or its copper sulfate solution were measured and indicate a one-step reduction and oxidation of copper (Cu+2 to Cu0). Less than 75 nm copper was electrodeposited from its solution in DES with round particles on zinc substrate. DES and its solution with Copper sulfate was investigated by UV-visible spectroscopy suggested an Oh coordination of Cu2+ to DES.
ISSN:2214-7853
2214-7853
DOI:10.1016/j.matpr.2021.08.122