Structural and mechanical analyses of soldering materials containing Pb, Sn, Ag, Cu, Bi and Zn

In present work the microstructural and mechanical properties (such as shear stress, shear strain, deformation and creep behaviour) of solder joints of four different solders at temperatures of 100 °C and 150 °C was studied. The soldering materials included in this study were: Type A—Sn-36.00Pb-2.00...

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Bibliographic Details
Published inMaterials today : proceedings Vol. 47; pp. S83 - S93
Main Authors Mazullah, Khan, Maaz, Ali, Ghafar, Khan, Muhammad Naeem, Zaib, Aurang, Abbas, Shafqat
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.01.2021
Subjects
Deformation
Microstructural
Shear Strain
Shear Stress
Soldering Materials
Soldering Materials
Shear Stress
Deformation
Shear Strain
Microstructural
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Summary:In present work the microstructural and mechanical properties (such as shear stress, shear strain, deformation and creep behaviour) of solder joints of four different solders at temperatures of 100 °C and 150 °C was studied. The soldering materials included in this study were: Type A—Sn-36.00Pb-2.00Ag, Type B—Sn-3.80Ag-0.70Cu, Type C—Sn-3.30Ag-3.82Bi and Type D—Sn-8.00Zn-3.00Bi. Microstructure and mechanical properties of solders were studied by using Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and Universal Testing Machine. It has been observed that the mechanical properties of Type B are not significantly changed with increase in temperature as compared to other materials.
ISSN:2214-7853
2214-7853
DOI:10.1016/j.matpr.2020.05.501