A numerica1 study of fluid flow and heat transfer in different microchannel heat sinks for electronic chip cooling
Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distrib...
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| Published in | Journal of mechanical science and technology Vol. 26; no. 4; pp. 1257 - 1263 |
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| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
| Published |
Heidelberg
Korean Society of Mechanical Engineers
01.04.2012
Springer Nature B.V 대한기계학회 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip’s temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks. |
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| AbstractList | Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip's temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip's temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks. Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip’s temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks. KCI Citation Count: 0 Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip's temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip's temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks.[PUBLICATION ABSTRACT] |
| Author | Hu, Guangxin Xu, Shanglong Qin, Jie Yang, Yue |
| Author_xml | – sequence: 1 givenname: Shanglong surname: Xu fullname: Xu, Shanglong email: xslbill@yahoo.com.cn organization: Department of Mechatronics Engineering, University of Electronic Science and Technology of China – sequence: 2 givenname: Guangxin surname: Hu fullname: Hu, Guangxin organization: Department of Mechatronics Engineering, University of Electronic Science and Technology of China – sequence: 3 givenname: Jie surname: Qin fullname: Qin, Jie organization: Department of Mechatronics Engineering, University of Electronic Science and Technology of China – sequence: 4 givenname: Yue surname: Yang fullname: Yang, Yue organization: School of Mechanical & Vehicle Engineering, Beijing Institute of Technology |
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| References | Qu, Mudawar (CR4) 2002; 45 Qu, Mudawar (CR5) 2002; 45 Dong, Chen, Yang, Bi, Wu, Zheng (CR10) 2005; 56 CR6 Qu, Mudawar (CR3) 2002; 45 Qu, Mudawar (CR2) 2002; 45 Tao (CR14) 2001 CR13 Dang, Hassan, Kim (CR12) 2007; Budapest Tuckerman, Pease (CR1) 1981; EDL-2 Wang, Ding (CR7) 2008; 18 Chen, Cheng (CR8) 2002; 45 Senn, Poulikakos (CR9) 2004; 130 Ngo, Kato, Nikitin, Ishizuka (CR11) 2007; 32 W. Qu (209_CR3) 2002; 45 Y. Wang (209_CR7) 2008; 18 W. Qu (209_CR2) 2002; 45 W. Qu (209_CR4) 2002; 45 T. Dong (209_CR10) 2005; 56 D. B. Tuckerman (209_CR1) 1981; EDL-2 W. Tao (209_CR14) 2001 S. M. Senn (209_CR9) 2004; 130 209_CR6 209_CR13 M. Dang (209_CR12) 2007; Budapest T. L. Ngo (209_CR11) 2007; 32 W. Qu (209_CR5) 2002; 45 Y. P. Chen (209_CR8) 2002; 45 |
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| SubjectTerms | Chips Computational fluid dynamics Control Cooling Dynamical Systems Electronics Engineering Heat exchange Heat sinks Heat transfer Industrial and Production Engineering Mechanical Engineering Microchannels Pressure drop Vibration 기계공학 |
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| Title | A numerica1 study of fluid flow and heat transfer in different microchannel heat sinks for electronic chip cooling |
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