A numerica1 study of fluid flow and heat transfer in different microchannel heat sinks for electronic chip cooling

• Published in: Journal of mechanical science and technology Vol. 26; no. 4; pp. 1257 - 1263
• Main Authors: Xu, Shanglong, Hu, Guangxin, Qin, Jie, Yang, Yue
• Format: Journal Article
• Language: English
• Published: Heidelberg Korean Society of Mechanical Engineers 01.04.2012; Springer Nature B.V; 대한기계학회
• Subjects: Chips; Computational fluid dynamics; Control; Cooling; Dynamical Systems; Electronics; Engineering; Heat exchange; Heat sinks; Heat transfer; Industrial and Production Engineering; Mechanical Engineering; Microchannels; Pressure drop; Vibration; 기계공학; Heat dissipation; Structure; Microchannel; Heat-flow coupling; Heat sink
• ISSN: 1738-494X; 1976-3824
• DOI: 10.1007/s12206-012-0209-x

Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip’s temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks.