Large-scale and facile fabrication of phenyl-containing silicone foam materials with lightweight, wide-temperature flexibility and tunable pore structure for exceptional thermal insulation

• Published in: Chemical engineering journal (Lausanne, Switzerland : 1996) Vol. 492; p. 152183
• Main Authors: Wu, Yu-Yue, Wu, Zhi-Hao, Chen, Zuan-Yu, Peng, Li-Dong, Guan, Zi-Qi, Li, Yang, Cao, Cheng-Fei, Zhang, Guo-Dong, Gao, Jie-Feng, Song, Pingan, Shi, Yong-Qian, Tang, Long-Cheng
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 15.07.2024
• Subjects: Phenyl group; Silicone foam material; Thermal insulation; Tunable pore structure; Wide-temperature flexibility; Silicone foam material; Phenyl group; Wide-temperature flexibility; Tunable pore structure; Thermal insulation

•Introducing phenyl groups onto Si–O–Si chains can tailor the foaming and cross-linking match.•The lowest density of the optimized PhSiRF material is as light as ∼100 mg/cm3.•The pore structure and morphology in the PhSiRF materials can be easily achieved.•The PhSiRF presents good wide-temperature f...