Large-scale and facile fabrication of phenyl-containing silicone foam materials with lightweight, wide-temperature flexibility and tunable pore structure for exceptional thermal insulation

• Published in: Chemical engineering journal (Lausanne, Switzerland : 1996) Vol. 492; p. 152183
• Main Authors: Wu, Yu-Yue, Wu, Zhi-Hao, Chen, Zuan-Yu, Peng, Li-Dong, Guan, Zi-Qi, Li, Yang, Cao, Cheng-Fei, Zhang, Guo-Dong, Gao, Jie-Feng, Song, Pingan, Shi, Yong-Qian, Tang, Long-Cheng
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 15.07.2024
• Subjects: Phenyl group; Silicone foam material; Thermal insulation; Tunable pore structure; Wide-temperature flexibility; Silicone foam material; Phenyl group; Wide-temperature flexibility; Tunable pore structure; Thermal insulation
• ISSN: 1385-8947
• DOI: 10.1016/j.cej.2024.152183

•Introducing phenyl groups onto Si–O–Si chains can tailor the foaming and cross-linking match.•The lowest density of the optimized PhSiRF material is as light as ∼100 mg/cm3.•The pore structure and morphology in the PhSiRF materials can be easily achieved.•The PhSiRF presents good wide-temperature flexibility and exceptional thermal insulation. Silicone foam materials with unique inorganic/organic molecular networks and porous structures are widely used in many emerging fields from aerospace to new energy fields. However, current silicone foam materials still show some limitations, such as the relatively high-density values of >200 mg cm−3, complex fabricating process and difficulty in tailoring pore structure. Herein, we report a large-scale and facile fabricating strategy to prepare phenyl-containing silicone foam materials (PhSiRF) with ultra-lightweight feature, tunable pore structure, and excellent wide-temperature mechanical flexibility. Interestingly, the presence of phenyl groups onto the Si–O–Si backbone tailors the chemical foaming rate probably due to the steric hindrance effect, thus producing tunable pore size distributions in the range of 180–500 μm. Typically, the PhSiRF with 50 % phenyl groups not only shows a very low density of ∼100 mg cm−3, superior to previous silicone foams and composites, but also exhibits wide-temperature flexibility (stable compressive strain of 80 % from −90 to 210 °C) and excellent thermal insulation performance, which outperforms those of conventional polymer foams including polyurethane, polyethylene and melamine foams. Based on the structure observation and theory analysis, the influence of different pore morphological structures on the thermal insulation performance is discussed and demonstrated. Clearly, this work provides a new yet simple method for developing high-performance silicone rubber foam materials for promising thermal insulation applications.