9.4‐inch 228‐ppi flexible micro‐LED display

• Published in: Journal of the Society for Information Display Vol. 29; no. 5; pp. 360 - 369
• Main Authors: Lee, Seok‐Lyul, Cheng, Chun‐Cheng, Liu, Chan‐Jui, Yeh, Cheng‐Nan, Lin, Yu‐Chieh
• Format: Journal Article
• Language: English
• Published: Campbell Wiley Subscription Services, Inc 01.05.2021
• Subjects: Backplanes; Brightness; Color; color shift free; flexible display; flip‐chip soldering; full‐color; Light emitting diodes; Low temperature; LTPS‐TFT; micro‐LED display; Polysilicon; Semiconductor devices; Thin film transistors; uniform brightness; User experience
• ISSN: 1071-0922; 1938-3657
• DOI: 10.1002/jsid.1022

A 9.4‐inch 228‐ppi full‐color micro‐LED display using the flexible low temperature polysilicon thin‐film transistor (LTPS‐TFT) backplane has been successfully developed. In order to solve the interconnection of tiny micro‐LEDs, those size are less than 30 μm, we introduced the flip‐chip soldering technology for high‐resolution flexible micro‐LED displays. Contrast ratio of >1,000,000:1 with a brightness of 700 nits was realized by the full‐color micro‐LED display with uniform brightness and color shift free at any off‐axis viewing angles. These supreme micro‐LED visual performances will provide a more comfortable user experience for high‐resolution flexible automotive applications. A 9.4‐inch 228‐ppi full‐color micro‐LED display using the flexible LTPS‐TFT backplane has been successfully developed. In order to solve the interconnection of tiny micro‐LEDs, we introduced the flip‐chip soldering technology for high‐resolution flexible micro‐LED displays. These supreme micro‐LED visual performances will provide a more comfortable user experience for high‐resolution flexible automotive applications. ​