In situ incorporation and loading of copper nanoparticles into a palmitic–lauric phase‐change material on polyester fibers

ABSTRACT This article introduces a facile approach for applying a eutectic mixture of fatty acid phase‐change materials (PCMs) on polyester fibers for thermal conductivity improvement via the in situ incorporation of copper nanoparticles. For this purpose, a eutectic mixture of palmitic acid and lau...

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Bibliographic Details
Published inJournal of applied polymer science Vol. 136; no. 3
Main Authors Rezaie, A. B., Montazer, M.
Format Journal Article
LanguageEnglish
Published Hoboken, USA John Wiley & Sons, Inc 15.01.2019
Wiley Subscription Services, Inc
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Summary:ABSTRACT This article introduces a facile approach for applying a eutectic mixture of fatty acid phase‐change materials (PCMs) on polyester fibers for thermal conductivity improvement via the in situ incorporation of copper nanoparticles. For this purpose, a eutectic mixture of palmitic acid and lauric acid was applied as PCMs and ascorbic acid was applied for the synthesis of copper nanoparticles. The thermal properties and stability of the treated samples were also determined by differential scanning calorimetry and thermogravimetry analysis. The treated samples indicated appropriate phase‐transition temperatures between 29.1 and 36.8 °C, with relevant latent heats of 49.4 and 49.9 J/g, respectively. The in situ formation of copper nanoparticles into eutectic fatty acid applied on the polyester fibers resulted in the promotion of the thermal conductivity of the composite by about 100.1% with the maximum amount of nanoparticles. In addition, the treated samples maintained good thermal durability and stability after 100 melting and freezing cycles. In addition, the tensile strength of the treated samples was improved. Overall, this treatment could be used to produce promising form‐stabilized composite PCMs and thermoregulated polymers and textiles with appropriate phase‐transition ranges and thermal conductivity. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 46951.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.46951