A qualitative model for degradation of FRAM® products during plastic packaging
A model for plastic package degradation of FRAM products involving both the thermal budget of the assembly process and the hydrogen evolution from the mold compound is proposed. Qualitative verification of the model is presented by utilizing ferroelectric aging data and failed bit analysis of the de...
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Published in | Integrated ferroelectrics Vol. 21; no. 1-4; pp. 145 - 153 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
Taylor & Francis Group
01.09.1998
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Subjects | |
Online Access | Get full text |
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Summary: | A model for plastic package degradation of FRAM products involving both the thermal budget of the assembly process and the hydrogen evolution from the mold compound is proposed. Qualitative verification of the model is presented by utilizing ferroelectric aging data and failed bit analysis of the defective parts along with the measured hydrogen evolution from the three mold compounds. The implications of the model on the choice of plastic mold compound are discussed. |
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ISSN: | 1058-4587 1607-8489 |
DOI: | 10.1080/10584589808202058 |