A qualitative model for degradation of FRAM® products during plastic packaging

A model for plastic package degradation of FRAM products involving both the thermal budget of the assembly process and the hydrogen evolution from the mold compound is proposed. Qualitative verification of the model is presented by utilizing ferroelectric aging data and failed bit analysis of the de...

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Bibliographic Details
Published inIntegrated ferroelectrics Vol. 21; no. 1-4; pp. 145 - 153
Main Authors Philofsk, Elliott, Mitra, Sanjay
Format Journal Article
LanguageEnglish
Published Taylor & Francis Group 01.09.1998
Subjects
carbon monoxide analysis
ferroelectric
hydrogen analysis
plastic packaging
retention
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Summary:A model for plastic package degradation of FRAM products involving both the thermal budget of the assembly process and the hydrogen evolution from the mold compound is proposed. Qualitative verification of the model is presented by utilizing ferroelectric aging data and failed bit analysis of the defective parts along with the measured hydrogen evolution from the three mold compounds. The implications of the model on the choice of plastic mold compound are discussed.
ISSN:1058-4587
1607-8489
DOI:10.1080/10584589808202058