A Hybrid De-Embedding Technique of Eye Diagram Measurement for High-Speed Digital Interconnections

By a modeling technique of equivalent lumped circuit for high-speed interconnections, an innovative method is proposed to predict the physical intrinsic eye diagram. Such a technique is based on the measured impedance profile results of time-domain reflectometry, which includes the electric characte...

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Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 4; no. 5; pp. 892 - 895
Main Authors Huang, Chi-Fang, Chao, Yen-Lin
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 01.05.2014
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Connectors
Equivalent circuits
Equivalent lumped circuit
eye diagram
Fixtures
high-speed interconnections
Impedance
Integrated circuit interconnections
Integrated circuit modeling
SPICE model
time-domain reflectometry (TDR)
Transmission line measurements
time-domain reflectometry (TDR)
Equivalent lumped circuit
high-speed interconnections
eye diagram
SPICE model
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Summary:By a modeling technique of equivalent lumped circuit for high-speed interconnections, an innovative method is proposed to predict the physical intrinsic eye diagram. Such a technique is based on the measured impedance profile results of time-domain reflectometry, which includes the electric characteristics both of the connector itself and testing jigs. The latter's are to be removed to leave the connector's part only for the eye diagram prediction. This method can be verified further by SPICE simulation and measurement in this paper.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2014.2309799