A COTS-Based Novel 3-D DRAM Memory Cube Architecture for Space Applications

• Published in: IEEE transactions on very large scale integration (VLSI) systems Vol. 28; no. 9; pp. 2055 - 2068
• Main Authors: Agnesina, Anthony, Yamaguchi, James, Krutzik, Christian, Carson, John, Yang-Scharlotta, Jean, Lim, Sung Kyu
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.09.2020; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Aerospace electronics; Application specific integrated circuits; Bandwidth; Circuit design; Control systems design; Controllers; Cubes; Dynamic random access memory; dynamic random-access memory (DRAM); Emulators; Fault tolerance; Integrated circuits; Memory devices; memory management; radiation effects; Radiation hardening; Random access memory; Space applications; Space missions; Testing; three-dimensional integrated circuit (3-D IC); Through-silicon vias

The first mainstream products in three-dimensional integrated circuit (3-D IC) design are memory devices where multiple memory tiers are horizontally integrated to offer manifold improvements when compared with their 2-D counterparts. Unfortunately, none of these existing 3-D memory cubes are ready...