Breaking-In a Pad for Scratch-Free, Cu Chemical-Mechanical Polishing

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 158; no. 4; p. H379
Main Authors Eusner, T., Saka, N., Chun, J.-H.
Format Journal Article
LanguageEnglish
Published 2011
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ISSN:0013-4651
DOI:10.1149/1.3545066