Through-Hole Filling by Copper Electroplating

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 155; no. 12; p. D750
Main Authors Dow, Wei-Ping, Chen, Hsiang-Hao, Yen, Ming-Yao, Chen, Wei-Hsiang, Hsu, Kao-Hsuang, Chuang, Po-Yao, Ishizuka, Hiroshi, Sakagawa, Nobuo, Kimizuka, Ryoichi
Format Journal Article
LanguageEnglish
Published 2008
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ISSN:0013-4651
DOI:10.1149/1.2988134