Thermoelastic Damping in Micromechanical Resonators with a Proof Mass and a Network of Suspension Beams

Predicting thermoelastic damping is crucial for the design of high $Q$ micromechanical resonators. In the past, for microresonators which consist of a proof mass and a network of suspension beams, some experiments showed that Zener's model [Phys. Rev. 52 (1937) 230; Phys. Rev. 53 (1938) 90] and...

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 50; no. 7; pp. 077202 - 077202-10
Main Authors Li, Pu, Hu, Rufu
Format Journal Article
LanguageEnglish
Published The Japan Society of Applied Physics 01.07.2011
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Summary:Predicting thermoelastic damping is crucial for the design of high $Q$ micromechanical resonators. In the past, for microresonators which consist of a proof mass and a network of suspension beams, some experiments showed that Zener's model [Phys. Rev. 52 (1937) 230; Phys. Rev. 53 (1938) 90] and Lifshitz and Roukes' model [Phys. Rev. B 61 (2000) 5600] can give a reasonable prediction, and others experiments showed that the two models fail to give a reasonable prediction. Few works give a reasonable and detailed explanation for this phenomenon. In this paper, a general proof is presented that shows Lifshitz and Roukes' model is valid for microresonators with a proof mass support by a network of suspension beams if all suspension beams are operated at pure bending vibration and all suspension beams have the same thickness. The accuracy of Lifshitz and Roukes' model is verified by comparing its results with the experimental results available in the literature.
Bibliography:A schematic drawing of a rigid proof mass supported by two simple microbeams. A schematic drawing of a rigid proof mass supported by folded beams. The $N$th beam element in local coordinates. TED in the resonator with $h=20$ μm as a function of frequency. TED in the three devices which have the same natural frequency and the same length, but have different thicknesses and proof masses.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.50.077202