Current-Collapse-Free and Fast Reverse Recovery Performance in Vertical GaN-on-GaN Schottky Barrier Diode

The recent emergence of free-standing GaN substrate has enabled the development of vertical GaN-on-GaN power devices. This letter presents the dynamic on -resistance (<inline-formula><tex-math notation="LaTeX">R_{\text{ON}}</tex-math></inline-formula>) and reverse r...

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Bibliographic Details
Published inIEEE transactions on power electronics Vol. 34; no. 6; pp. 5012 - 5018
Main Authors Han, Shaowen, Yang, Shu, Li, Rui, Wu, Xinke, Sheng, Kuang
Format Journal Article
LanguageEnglish
Published New York IEEE 01.06.2019
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:The recent emergence of free-standing GaN substrate has enabled the development of vertical GaN-on-GaN power devices. This letter presents the dynamic on -resistance (<inline-formula><tex-math notation="LaTeX">R_{\text{ON}}</tex-math></inline-formula>) and reverse recovery performance of a novel vertical GaN-on-GaN Schottky barrier diode (SBD) characterized by a double pulse tester. The vertical GaN-on-GaN SBD exhibits fast reverse recovery with a low <inline-formula><tex-math notation="LaTeX">R_{\text{ON}}</tex-math></inline-formula>·<inline-formula><tex-math notation="LaTeX">Q_{\rm rr}</tex-math></inline-formula> figure-of-merit. For the first time, the current-collapse-free performance (i.e., no dynamic <inline-formula><tex-math notation="LaTeX">R_{\text{ON}}</tex-math></inline-formula> degradation) has been experimentally verified in a vertical GaN power rectifier under different switching conditions including: off -state stress bias up to 500 V, off -state stress time within 10 −6 -10 2 s, high temperature up to 150 °C, and different load current levels.
ISSN:0885-8993
1941-0107
DOI:10.1109/TPEL.2018.2876444